CPU-Z 
  
Binaries 
CPU-Z version2.04.0.x64
  
Processors 
CPU Groups1
CPU Group 08 threads, mask=0xFF
  
Number of sockets1
Number of threads8
  
APICs 
Socket 0
     -- Core 0 (ID 0)
         -- Thread 00
         -- Thread 11
     -- Core 1 (ID 1)
         -- Thread 22
         -- Thread 33
     -- Core 2 (ID 2)
         -- Thread 44
         -- Thread 55
     -- Core 3 (ID 3)
         -- Thread 66
         -- Thread 77
  
Timers 
     ACPI timer3.580 MHz
     Perf timer10.000 MHz
     Sys timer1.000 KHz
  
  
Processors Information 
Socket 1ID = 0
     Number of cores4 (max 4)
     Number of threads8 (max 8)
     ManufacturerGenuineIntel
     NameIntel Core i7 3770
     CodenameIvy Bridge
     SpecificationIntel(R) Core(TM) i7-3770 CPU @ 3.40GHz
     Package (platform ID)Socket 1155 LGA (0x1)
     CPUID6.A.9
     Extended CPUID6.3A
     Core SteppingE1/L1
     Technology22 nm
     TDP Limit77.0 Watts
     Tjmax105.0 °C
     Core Speed1597.9 MHz
     Multiplier x Bus Speed16.0 x 99.9 MHz
     Base frequency (cores)99.9 MHz
     Base frequency (mem.)99.9 MHz
     Stock frequency3400 MHz
     Instructions setsMMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES, AVX
     Microcode Revision0x21
     L1 Data cache4 x 32 KB (8-way, 64-byte line)
     L1 Instruction cache4 x 32 KB (8-way, 64-byte line)
     L2 cache4 x 256 KB (8-way, 64-byte line)
     L3 cache8 MB (16-way, 64-byte line)
     Max CPUID level0000000Dh
     Max CPUID ext. level80000008h
     FID/VID Controlyes
  
  
     Turbo Modesupported, enabled
     Max non-turbo ratio34x
     Max turbo ratio39x
     Max efficiency ratio16x
     Min Power60 Watts
     O/C bins+4
     Ratio 1 core39x
     Ratio 2 cores39x
     Ratio 3 cores38x
     Ratio 4 cores37x
     TDP Level77.0 W @ 34x
  
     Temperature 027 degC (80 degF) (Package)
     Temperature 127 degC (80 degF) (Cores (Max))
     Temperature 227 degC (80 degF) (Core #0)
     Temperature 327 degC (80 degF) (Core #1)
     Temperature 427 degC (80 degF) (Core #2)
     Temperature 527 degC (80 degF) (Core #3)
     Voltage 01.02 Volts (VID)
     Power 006.67 W (Package)
     Power 012.28 W (IA Cores)
     Power 02n.a. (GT)
     Power 034.40 W (Uncore)
     Clock Speed 01597.91 MHz (Core #0)
     Clock Speed 11597.91 MHz (Core #1)
     Clock Speed 21597.91 MHz (Core #2)
     Clock Speed 31597.91 MHz (Core #3)
     Core 0 max ratio39.00 (effective 39.00)
     Core 1 max ratio39.00 (effective 39.00)
     Core 2 max ratio39.00 (effective 39.00)
     Core 3 max ratio39.00 (effective 39.00)
  
  
  
Chipset 
NorthbridgeIntel Ivy Bridge rev. 09
SouthbridgeIntel H77 rev. 04
Bus SpecificationPCI-Express 3.0 (8.0 GT/s)
Graphic InterfacePCI-Express 3.0
PCI-E Link Widthx16 (max 16x)
PCI-E Link Speed2.5 GT/s (max 8.0 GT/s)
Memory TypeDDR3
Memory Size16 GBytes
ChannelsDual
Memory Frequency799.0 MHz (1:6)
CAS# latency (CL)11.0
RAS# to CAS# delay (tRCD)11
RAS# Precharge (tRP)11
Cycle Time (tRAS)28
Row Refresh Cycle Time (tRFC)128
Command Rate (CR)2T
Host Bridge0x0150
  
Memory SPD 
DIMM #1
     SMBus address0x50
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE00000000000000000000000000)
     SDRAM Manufacturer (ID)Samsung (CE00000000000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B5273CH0-CK0
     Serial numberD14E3E83
     Manufacturing dateWeek 35/Year 12
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
DIMM #2
     SMBus address0x51
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE00000000000000000000000000)
     SDRAM Manufacturer (ID)Samsung (CE00000000000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B5273CH0-CK0
     Serial number618F826E
     Manufacturing dateWeek 35/Year 12
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
DIMM #3
     SMBus address0x52
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE00000000000000000000000000)
     SDRAM Manufacturer (ID)Samsung (CE00000000000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B5273CH0-CK0
     Serial numberD14E3E7A
     Manufacturing dateWeek 35/Year 12
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
DIMM #4
     SMBus address0x53
     Memory typeDDR3
     Module formatUDIMM
     Module Manufacturer(ID)Samsung (CE00000000000000000000000000)
     SDRAM Manufacturer (ID)Samsung (CE00000000000000000000000000)
     Size4096 MBytes
     Max bandwidthPC3-12800 (800 MHz)
     Part numberM378B5273CH0-CK0
     Serial numberD14E3E82
     Manufacturing dateWeek 35/Year 12
     Number of banks8
     Nominal Voltage1.50 Volts
     EPPno
     XMPno
     AMPno
     EXPOno
JEDEC timings tableCL-tRCD-tRP-tRAS-tRC @ frequency
     JEDEC #16.0-6-6-16-22 @ 457 MHz
     JEDEC #27.0-7-7-19-26 @ 533 MHz
     JEDEC #38.0-8-8-22-30 @ 609 MHz
     JEDEC #49.0-9-9-24-33 @ 685 MHz
     JEDEC #510.0-10-10-27-37 @ 761 MHz
     JEDEC #611.0-11-11-28-39 @ 800 MHz
  
  
Monitoring 
Mainboard Model0NW73C (0x00000182 - 0x00589E60)
  
LPCIO 
LPCIO VendorITE
LPCIO ModelIT8772
LPCIO Vendor ID0x90
LPCIO Chip ID0x8772
LPCIO Revision ID0x1
  
Hardware Monitors 
Hardware monitorITE IT8772
     Voltage 00.86 Volts [0x48] (CPU VCORE)
     Voltage 11.50 Volts [0x7D] (VIN1)
     Voltage 22.04 Volts [0xAA] (+3.3V)
     Voltage 32.78 Volts [0x8A] (+5V)
     Voltage 6-8.93 Volts [0xBA] (-5V)
     Voltage 72.76 Volts [0x89] (+5V VCCH)
     Voltage 81.61 Volts [0x86] (VBAT)
     Fan 1907 RPM [0x2E8] (FANIN1)
     Fan 2871 RPM [0x307] (FANIN2)
  
Hardware monitorAMD ADL
     Clock Speed 0300.00 MHz [0x12C] (Graphics)
     Clock Speed 1150.00 MHz [0x96] (Memory)
     Clock Speed 2n.a. (Processor)
  
  
PCI Devices 
DescriptionHost Bridge
Locationbus 0 (0x00), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x0150
     Revision ID0x09
PCI header
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x00
     Int. Pin0x00
PCI capability
     Caps classVendor Dependant
     Caps offset0xE0
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 1 (0x01), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x0151
     Revision ID0x09
PCI header
     Primary bus0x00
     Secondary bus0x01
     Int. Line0x0B
     Int. Pin0x01
PCI capability
     Caps classSubsystem Vendor
     Caps offset0x88
     SubVendor ID0x1028 (Dell)
     SubSystem ID0x0545
PCI capability
     Caps classPower Management
     Caps offset0x80
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x90
PCI capability
     Caps classPCI Express
     Caps offset0xA0
     Device typeRoot Port of PCI-E Root Complex
     Port2
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 8.0 GT/s)
  
DescriptionUSB Controller (xHCI)
Locationbus 0 (0x00), device 20 (0x14), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E31
     Revision ID0x04
PCI header
     Address 0 (memory)0x00000000F7F00000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x70
     Caps version1.1
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x80
  
DescriptionCommunication Device
Locationbus 0 (0x00), device 22 (0x16), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E3A
     Revision ID0x04
PCI header
     Address 0 (memory)0x00000000F7F1A000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x10
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x8C
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 26 (0x1A), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E2D
     Revision ID0x04
PCI header
     Address 0 (memory)0xF7F18000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x10
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.1
PCI capability
     Caps classDebug Port
     Caps offset0x58
PCI capability
     Caps class0x13
     Caps offset0x98
  
DescriptionHigh Definition Audio (HDA)
Locationbus 0 (0x00), device 27 (0x1B), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E20
     Revision ID0x04
PCI header
     Address 0 (memory)0x00000000FEAFC000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x16
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.1
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x60
PCI capability
     Caps classPCI Express
     Caps offset0x70
     Device typeRoot Complex Integrated Endpoint Device
     Port0
     Caps version1.0
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E10
     Revision ID0xC4
PCI header
     Primary bus0x00
     Secondary bus0x02
     Int. Line0x0B
     Int. Pin0x01
PCI capability
     Caps classPCI Express
     Caps offset0x40
     Device typeRoot Port of PCI-E Root Complex
     Port1
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width1x (max 1x)
     Link speed2.5 GT/s (max 5.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x80
PCI capability
     Caps classSubsystem Vendor
     Caps offset0x90
     SubVendor ID0x1028 (Dell)
     SubSystem ID0x0545
PCI capability
     Caps classPower Management
     Caps offset0xA0
     Caps version1.1
  
DescriptionPCI to PCI Bridge
Locationbus 0 (0x00), device 28 (0x1C), function 3 (0x03)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E16
     Revision ID0xC4
PCI header
     Primary bus0x00
     Secondary bus0x03
     Int. Line0x05
     Int. Pin0x04
PCI capability
     Caps classPCI Express
     Caps offset0x40
     Device typeRoot Port of PCI-E Root Complex
     Port4
     Caps version2.0
     Physical slot#0
     Presence detectyes
     Link width1x (max 1x)
     Link speed2.5 GT/s (max 5.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x80
PCI capability
     Caps classSubsystem Vendor
     Caps offset0x90
     SubVendor ID0x1028 (Dell)
     SubSystem ID0x0545
PCI capability
     Caps classPower Management
     Caps offset0xA0
     Caps version1.1
  
DescriptionUSB 2.0 Controller (EHCI)
Locationbus 0 (0x00), device 29 (0x1D), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E26
     Revision ID0x04
PCI header
     Address 0 (memory)0xF7F17000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x17
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.1
PCI capability
     Caps classDebug Port
     Caps offset0x58
PCI capability
     Caps class0x13
     Caps offset0x98
  
DescriptionPCI to ISA Bridge
Locationbus 0 (0x00), device 31 (0x1F), function 0 (0x00)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E4A
     Revision ID0x04
PCI header
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x00
     Int. Pin0x00
PCI capability
     Caps classVendor Dependant
     Caps offset0xE0
  
DescriptionSerial ATA Controller - AHCI
Locationbus 0 (0x00), device 31 (0x1F), function 2 (0x02)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E02
     Revision ID0x04
PCI header
     Address 0 (port)0x0000F070
     Address 1 (port)0x0000F060
     Address 2 (port)0x0000F050
     Address 3 (port)0x0000F040
     Address 4 (port)0x0000F020
     Address 5 (memory)0xF7F16000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x13
     Int. Pin0x02
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x80
PCI capability
     Caps classPower Management
     Caps offset0x70
     Caps version1.2
PCI capability
     Caps classSerial ATA Configuration
     Caps offset0xA8
PCI capability
     Caps class0x13
     Caps offset0xB0
  
DescriptionSMBus Controller
Locationbus 0 (0x00), device 31 (0x1F), function 3 (0x03)
Common header
     Vendor ID0x8086 (Intel)
     Model ID0x1E22
     Revision ID0x04
PCI header
     Address 0 (memory)0x00000000F7F15000
     Address 4 (port)0x0000F000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x0B
     Int. Pin0x03
  
DescriptionVGA Controller
Locationbus 1 (0x01), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x1002 (AMD)
     Model ID0x6818
     Revision ID0x00
PCI header
     Address 0 (memory)0x00000000E0000000
     Address 2 (memory)0x00000000F7E00000
     Address 4 (port)0x0000E000
     Subvendor ID0x1002 (AMD)
     Subsystem ID0x0B04
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeLegacy PCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 8.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
  
DescriptionHigh Definition Audio (HDA)
Locationbus 1 (0x01), device 0 (0x00), function 1 (0x01)
Common header
     Vendor ID0x1002 (AMD)
     Model ID0xAAB0
     Revision ID0x00
PCI header
     Address 0 (memory)0x00000000F7EFC000
     Subvendor ID0x1002 (AMD)
     Subsystem ID0xAAB0
     Int. Line0x11
     Int. Pin0x02
PCI capability
     Caps classVendor Dependant
     Caps offset0x48
PCI capability
     Caps classPower Management
     Caps offset0x50
     Caps version1.2
PCI capability
     Caps classPCI Express
     Caps offset0x58
     Device typeLegacy PCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width16x (max 16x)
     Link speed2.5 GT/s (max 8.0 GT/s)
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0xA0
  
DescriptionNetwork Controller
Locationbus 2 (0x02), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x168C (Qualcomm Atheros)
     Model ID0x0032
     Revision ID0x01
PCI header
     Address 0 (memory)0x00000000F7D80000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0209
     Int. Line0x10
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x40
     Caps version1.1
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPCI Express
     Caps offset0x70
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width1x (max 1x)
     Link speed2.5 GT/s (max 2.5 GT/s)
  
DescriptionEthernet Controller
Locationbus 3 (0x03), device 0 (0x00), function 0 (0x00)
Common header
     Vendor ID0x10EC (Realtek)
     Model ID0x8168
     Revision ID0x07
PCI header
     Address 0 (port)0x0000D000
     Address 2 (memory)0x00000000F0004000
     Address 4 (memory)0x00000000F0000000
     Subvendor ID0x1028 (Dell)
     Subsystem ID0x0545
     Int. Line0x00
     Int. Pin0x01
PCI capability
     Caps classPower Management
     Caps offset0x40
     Caps version1.2
PCI capability
     Caps classMessage Signalled Interrupts
     Caps offset0x50
PCI capability
     Caps classPCI Express
     Caps offset0x70
     Device typePCI-E Endpoint Device
     Port0
     Caps version2.0
     Link width1x (max 1x)
     Link speed2.5 GT/s (max 2.5 GT/s)
PCI capability
     Caps classMSI-X
     Caps offset0xB0
PCI capability
     Caps classVirtual Product Data
     Caps offset0xD0
  
  
DMI 
SMBIOS Version2.7
  
DMI BIOS
     vendorDell Inc.
     versionA14
     date06/25/2018
     ROM size4096 KB
  
DMI System Information
     manufacturerDell Inc.
     productXPS 8500
     versionunknown
     serialDR64H5J
     UUID{4C4C4544-0052-3610-8034-C4C04F48354A}
     SKUTo be filled by O.E.M.
     familyTo be filled by O.E.M.
  
DMI Baseboard
     vendorDell Inc.
     model0NW73C
     revisionA00
     serial..CN7220029S06R4.
  
DMI System Enclosure
     manufacturerDell Inc.
     chassis typeDesktop
     chassis serialDR64H5J
  
DMI Port Connector
     designationSATA-0 (internal)
     designationSATA-0 (external)
  
DMI Port Connector
     designationSATA-1 (internal)
     designationSATA-1 (external)
  
DMI Port Connector
     designationSATA-2 (internal)
     designationSATA-2 (external)
  
DMI Port Connector
     designationSATA-3 (internal)
     designationSATA-3 (external)
  
DMI Port Connector
     designationMSATA-1 (internal)
     designationMSATA-1 (external)
  
DMI Port Connector
     designationNULL (internal)
     designationUSB0 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB1 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB2 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB3 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB4 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB5 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB6 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB7 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB8 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB9 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB10 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationUSB11 (external)
     port typeUSB
  
DMI Port Connector
     designationNULL (internal)
     designationAUDIO (external)
     port typeAudio Port
  
DMI Port Connector
     designationNULL (internal)
     designationETHERNET (external)
     port typeNetwork Port
     connectorRJ-45
  
DMI Extension Slot
     designationPCIE1
     typePCI Express
     populatedno
  
DMI Extension Slot
     designationPCIE2
     typePCI Express
     populatedno
  
DMI Extension Slot
     designationPCIE3
     typePCI Express
     populatedno
  
DMI Extension Slot
     designationPCIE4
     typePCI Express
     populatedno
  
DMI OEM Strings
     string[0]Dell System
     string[1]5[0000]
     string[2]3[3.4]
     string[3]4[0001]
     string[4]13[D03M]
     string[5]6[D0, D4, D8, DA, DE]
     string[6]7[]
     string[7]8[]
     string[8]9[]
     string[9]1[0545]
     string[10]10[A13]
     string[11]12[]
     string[12]14[0]
     string[13]14[0]
     string[14]
  
DMI Physical Memory Array
     locationMotherboard
     usageSystem Memory
     correctionNone
     max capacity32 GB
     max# of devices4
  
DMI Processor
     manufacturerIntel
     modelIntel(R) Core(TM) i7-3770 CPU @ 3.40GHz
     clock speed3400.0 MHz
     FSB speed100.0 MHz
     multiplier34.0x
     max clock speed3400.0 MHz
  
DMI Memory Device
     designationDIMM3
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     speed1600 MHz
     manufacturerSamsung
     part numberM378B5273CH0-CK0
     serial numberD14E3E83
     voltage0.051000
     manufacturer id0x6E75
     product id0x67
  
DMI Memory Device
     designationDIMM1
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size4 GB
     speed1600 MHz
     manufacturerSamsung
     part numberM378B5273CH0-CK0
     serial number618F826E
     voltage0.049000
     manufacturer id0x6E75
     product id0x67
  
DMI Memory Device
     designationDIMM4
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     speed1600 MHz
     manufacturerSamsung
     part numberM378B5273CH0-CK0
     serial numberD14E3E7A
     voltage0.052000
     manufacturer id0x6E75
     product id0x67
  
DMI Memory Device
     designationDIMM2
     formatDIMM
     typeDDR3
     total width64 bits
     data width64 bits
     size4 GB
     speed1600 MHz
     manufacturerSamsung
     part numberM378B5273CH0-CK0
     serial numberD14E3E82
     voltage0.050000
     manufacturer id0x6E75
     product id0x67
  
  
Graphics 
Number of adapters1
  
Graphic APIs 
APID3D
APIATI I/O
APIADL SDK
  
Display Adapters 
Display adapter 0
     ID0x2000000
     NameAMD Radeon HD 7870
     Board ManufacturerAdvanced Micro Devices Inc. (AMD)
     Cores1280
     ROP Units32
     Memory size2 GB
     PCI devicebus 1 (0x1), device 0 (0x0), function 0 (0x0)
         Vendor ID0x1002 (0x1002)
         Model ID0x6818 (0x0B04)
         Revision ID0x0
     Root devicebus 0 (0x0), device 1 (0x1), function 0 (0x0)
     Performance LevelCurrent
         Core clock300.0 MHz
         Memory clock150.0 MHz
     Driver version8.17.10.1433
     WDDM Model2.0
  
Win32_VideoControllerAdapterRAM = 0x80000000 (2147483648)
Win32_VideoControllerDriverVersion = 15.301.1701.0
Win32_VideoControllerDriverDate = 01/13/2016
  
Monitor 0
     ModelBenQ GL2250H ()
     IDBNQ78A1
     Serial23E02511019
     Manufacturing DateWeek 9, Year 2014
     Size21.7 inches
     Max Resolution1920 x 1080 @ 60 Hz
     Horizontal Freq. Range30-83 kHz
     Vertical Freq. Range50-76 Hz
     Max Pixel Clock210 MHz
     Gamma Factor2.2
  
  
Software 
Windows VersionMicrosoft Windows 10 (10.0) Professional 64-bit (Build 19045)
DirectX Version12.0