sightseeer
Lt. Junior Grade
- Registriert
- Juni 2013
- Beiträge
- 284
ich finde den thread mit den wärmeleitpasten nicht, ich muss umbedingt wissen ob ich
"WAKEFIELD" thermal joint compond TYPE 120 SILICONE
für einen i5 6600k auf ASUS z170 pro gaming nutzen kann.
Da steht drauf:
Type 120 thermal joint compound will improve the heat flow between mechanically espoused surfaces such as Wakefield Engineering heat sinks and semiconductors. Also, corrosion is reduced between dissimilar materials. Type 120 has four times the thermal conductivity of standard silicone oils and greases. Tests have show that the thermal resistance between a semiconductor case and a heat sink can be reduced as much as 60% by using Type 120. A one year testing program has shown that this thermal joint compound is effective indefinitely at heat sink temperatures of 100°C. This product is not toxic or harmful to skin. Before using, read and understand the Material Safety Data Sheet.
Kann mir das jemand absegnen
Gruß,
seb7o
"WAKEFIELD" thermal joint compond TYPE 120 SILICONE
für einen i5 6600k auf ASUS z170 pro gaming nutzen kann.
Da steht drauf:
Type 120 thermal joint compound will improve the heat flow between mechanically espoused surfaces such as Wakefield Engineering heat sinks and semiconductors. Also, corrosion is reduced between dissimilar materials. Type 120 has four times the thermal conductivity of standard silicone oils and greases. Tests have show that the thermal resistance between a semiconductor case and a heat sink can be reduced as much as 60% by using Type 120. A one year testing program has shown that this thermal joint compound is effective indefinitely at heat sink temperatures of 100°C. This product is not toxic or harmful to skin. Before using, read and understand the Material Safety Data Sheet.
Kann mir das jemand absegnen
Gruß,
seb7o